After confirming new holographic display technology and Snapdragon 855 SoC for the flagship Mi 9 smartphone earlier this week, ahead of Feb...
After confirming new holographic display technology and Snapdragon 855 SoC for the flagship Mi 9 smartphone earlier this week, ahead of February 20 announcement, today Xiaomi’s CEO Lei Jun has confirmed the camera specifications of the smartphone. Xiaomi Mi 9 camera specifications 48-megapixel main camera with f/1.75 aperture, 6P lens, 1/2.0" Sony IMX586 sensor, 0.8μm pixel size, 4-in-1 pixel binning 12-megapixel telephoto lens with f/2.2 aperture, 1.0μm pixel size, 6P lens, 2x lossless zoom 16-megapixel 117-degree ultra-wide angle lens with f/2.2 aperture, 1.0μm pixel size, 6P lens, also supports supports 4cm macro at the same time 20-megapixel front camera with support for AI beauty features Xiaomi co-founder Bin Lin also shared a new camera sample from the 16-megapixel ultra-wide angle lens and said that it has implemented anti-distortion algorithm for achieving a perfect shot. Earlier images revealed a camera bump. Now the company has confirmed that the camera part has 243 square millimeters of Sapphire Glass protection as well as stainless steel frame wrapped around the area to protect these lenses form scratches. The chin of Mi 9 is just 3.6mm wide, making it 40% narrower than the Mi 8, which the company says is possible due to improved internal design. Source 1, 2, 3from Fone Arena http://bit.ly/2N8cCTN
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